The ADAM deposition system is an ultra-high vacuum, dc-magnetron sputtering system.
ADAM uses 5 dc-magnetron sputter guns (which accommodate 1.5″ diameter targets) to deposit both metals and insulators in an Argon environment. All five materials can be co-sputtered. Substrates can be heated to 800°C.
With these capabilities and a base pressure on the order of 4 x 10-9 Torr, the ADAM deposition system is an excellent tool for the development of novel thin films and heterostructures for both fundamental research and device development.
Current location: Bevill 1064