Dendrimer-Based Hybrid Nanocomposite Films

Shane Street and Mark Weaver
Center for Materials for Information Technology
The University of Alabama, Tuscaloosa, Alabama 35487-0209

John Barnard
Dept. of Materials Science and Engineering
University of Pittsburgh, Pittsburgh, PA 15261

Dendrimer Assisted Nanotransfer Printing (nTP)

We have recently shown that a monolayer of a dendrimer on a silicon substrate allows direct transfer of ultrathin metal films from a patterned stamp onto the substrate. In this method, a dendrimer monolayer is self-assembled onto the substrate from solution. A metal layer, or layers, is deposited in vacuum onto a patterned polymer stamp, itself formed over a hard master using photolithography or other technique. When the stamp is brought into contact with the dendrimer modified substrate, the metal is transferred to the substrate. The image below shows 20 nm high Co “wires” patterned in this way. It is possible to transfer metal multilayers using this technique, allowing direct patterned transfer of, for instance, a magnetic metal layer sandwiched between two nonmagnetic layers, a structure which would have technological interest (e.g., magnetic sensors).