• August 3rd, 2010
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The ADAM deposition system is an ultra-high vacuum, dc-magnetron sputtering system.

ADAM uses 5 dc-magnetron sputter guns (which accommodate 1.5″ diameter targets) to deposit both metals and insulators in an Argon environment. All five materials can be co-sputtered. Substrates can be heated to 800°C.

With these capabilities and a base pressure on the order of 4 x 10-9 Torr, the ADAM deposition system is an excellent tool for the development of novel thin films and heterostructures for both fundamental research and device development.

Current location: Bevill 1064